The global radiation-hardened electronics market size reached USD 1.45 Billion in 2021 and is expected to register a revenue CAGR of 3.5% during the forecast period, according to latest analysis by Emergen Research. Increasing demand for satellite communications in television broadcast, mobile phone connectivity, space-based monitoring, and surveillance are driving radiation-hardened electronics market revenue growth.
Increasing use of radiation-hardened electronics in several high-altitude applications is driving market revenue growth. This type of electronics are made of components such as silicon, silicon carbide, and gallium nitride, which are resistant to gamma and neutron radiation and high-energy radiation. These factors drive its adoption in applications such as aircraft, nuclear power plants, and satellites in the form of power supply devices, microprocessors, and switching regulators.
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Increasing ISR activities in defense sector are driving radiation-hardened electronics market growth. ISR activities are effective with use of highly reliable and advanced quality electronics products. For space operations, electronic products are required to survive for a minimum of 15 years without any breakdown. Radiation-hardened electronics facilitate these requirements and thus are increasingly being used in ISR operations happening in military and commercial applications.
The Global Radiation Hardened Electronics Market Research Report provides a brief overview inclusive of the competitive landscape and key developments, policies, manufacturing costs, and processes. The report also provides the analysis of import/export, production and consumption ratio, supply and demand, cost, price, estimated revenue, and gross margins. The report further discusses in detail the driving factors influencing the growth of the market currently and in the coming years.
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The report further explores the key business players along with their in-depth profiling, product catalog, and strategic business decisions. The key players studied in the report are BAE Systems, Honeywell International Inc., Renesas Electronics Corporation, STMicroelectronics, Infineon Technologies AG, Microchip Technology Inc., IBM, Data Device Corporation, Cobham Limited, and Micropac Industries, Inc.
Regional Bifurcation of the Radiation Hardened Electronics Market Includes:
North America (U.S., Canada)
Europe (U.K., Italy, Germany, France, Rest of EU)
Asia Pacific (India, Japan, China, South Korea, Australia, Rest of APAC)
Latin America (Chile, Brazil, Argentina, Rest of Latin America)
Middle East Africa (Saudi Arabia, U.A.E., South Africa, Rest of MEA)
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Emergen Research has segmented global radiation-hardened electronics market on the basis of product type, material type, manufacturing technique, component type, application, and region:
Product Type Outlook (Revenue, USD Million; 2019–2030)
Material Type Outlook (Revenue, USD Million; 2019–2030)
Manufacturing Technique Outlook (Revenue, USD Million; 2019–2030)
Component Type Outlook (Revenue, USD Million; 2019–2030)
Field-Programmable Gate Array
Application Specific Integrated Circuit
Analog Digital Mix Signals
Application Outlook (Revenue, USD Million; 2019–2030)
Nuclear Power Plants
Highlights of Table of Contents (TOC):
Overview of Global Radiation Hardened Electronics Market
Competitive analysis of the Radiation Hardened Electronics market
Regional analysis of Global Radiation Hardened Electronics market production and revenue
Regional analysis of Global Radiation Hardened Electronics market supply, consumption, and export import
Type-based market analysis of global Radiation Hardened Electronics production, revenue, and price trends
Application-based analysis of the global Radiation Hardened Electronics market
Manufacturer profiles, manufacturing cost, and upstream and downstream analysis of global Radiation Hardened Electronics market
Global Radiation Hardened Electronics market forecast (2021-2028)
Conclusion of the research report
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